Suprel Metalwork Co., Ltd
Suprel Metalwork Co., Ltd
Home> Industry Information> Upgrading of 5G base station cooling technology require new challenges for extrusion and CNC machining

Upgrading of 5G base station cooling technology require new challenges for extrusion and CNC machining

June 19, 2023

With the arrival of the peak of 5G base station construction, it is expected that the scale of the domestic base station cooling market is expected to exceed 6 billion yuan by 2025. In addition, the arrival of the 5G mobile phone replacement trend will further drive the demand for cooling in the market. So, what challenges do these manufacturers of extrusion and cnc machining have? There are mainly three aspects:

1) Upgrades in product design and processing technology, as well as further development in material research and development

Centralized procurement of base stations is the largest investment in the construction of 5G networks. In every process of building base stations, it is necessary to equip them with Heat Sinks. The acceleration of the landing of 5G base stations has led to a surge in demand for heat dissipation structural components like Computer Radiator or server CPU cooler, Cooling Fin or Heat Sink Strip. At the same time, it has also brought a new wave of challenges and opportunities to enterprises upstream and downstream of the industrial chains. 

2) Apart from upgrading the product design and processing technology, there has also been further developing requirements in material research and development. Pure aluminum and aluminum alloys are widely used materials in base station structural components, and some manufacturers have developed magnesium alloy products with high thermal conductivity through certain technological accumulation.

In addition, there are some new heat dissipating materials, such as Graphene, graphite flakes, thermal conductive silicone flakes, etc. The implementation of 5G and the acceleration of base station coverage also pose new challenges and opportunities to the upstream and downstream of the industrial chain. According to Huachuang Securities, with the trend of high-performance and miniaturization of electronic devices, the importance of heat dissipation/cooling design in electronic device development continues to increase. Compared to 4G, the power consumption of 5G devices has significantly increased, and there is a need to upgrade the cooling scheme.
3) Increased requirements for deburring

After machining, the 5G communication cavity and 5G substrate (aluminum profile) will have various surface holes, bosses, groove surfaces, transverse notches, and burrs at the chamfer mouth. Due to its small size and high accuracy, deburring is also a challenge.

In a word, challenges and innovative development coexist, we believe our cooling technology will continue to flourish in the future! Suprel company are striving to develop our metal processing technology and will also go further in radiator technologies.



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